Toshiba 128GB Embedded NAND Flash Memory for Handheld Devices is World’s First
Japanese company Toshiba issued a press statement confirming that they have accomplished creating a massive 128 GB NAND flash storage for embedding to smart gadgets. The company plans to ship samples of this record-setting NAND chip to manufacturers by September of this year and they expect to go into mass-production by next year. If you are already in awe of the 64GB storage of the Apple iPad, wait till you get double capacity from Toshiba’s latest chip. We all can look forward to digital cameras, smart phones and tablet computers sporting 128 GB built-in internal storage within the next two years.
Toshiba’s achievement was done by combining sixteen 64Gbit (Equivalent to 8GB) NAND chips on a single package measuring only 17 x 22 x 1.4 mm. The company is the first to do this using their proprietary 32nm fabrication process. This compact size already includes the dedicated controller to manage basic NAND functions. This high-capacity flash module is fully compliant with the JEDEC e-MMC standard now being used by all NAND flash chips.
Recent smart phone models like the HTC EVO 4G and iPhone 4 are now capable of recording HD videos. Toshiba’s new product will help end-users maximize this feature by allowing users to have more space for capturing high-def videos. The considerable 128 GB storage will let them record up to 16 hours of HD video. Game makers will also benefit from the increased storage by letting them increase texture pixel counts on 3D video games to achieve a more polished look.
Toshiba 128GB NAND Flash Memory Key Features
- The JEDEC e•MMCTM V4.4 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.
- Embedded in a system, the module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video.
- The 128GB device stacks sixteen 64Gbit chips fabricated with leading-edge 32nm process technology. Application of advanced chip thinning, layering and wire bonding technologies has allowed Toshiba to achieve individual chips only 30 micrometers thick, and to layer and bond them in a small package. The result is an embedded NAND flash memory module with the industry’s highest density.
- The new products are sealed in a small FBGA package only 17 x 22 x 1.4mm and has a signal layout compliant with the JEDEC e•MMCTM V4.4.
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